products details

Casa prodotti

HDI PCB PCB Prototype Mass Production Minimum Line Space 0.075mm High Density Interconnect Circuit Board Services

MOQ:	1 pannello
prezzo:	Negoziabile
Payment Terms:	T/T

Detail Information

Descrizione di prodotto

Detail Information

Place of Origin:

China

Certificazione:

ISO9001, ISO13485,TS16949

Tipo di prodotto:

PCB HDI a 8 strati

Materiale:

FR4 Alta Tg S1000-2M

Spessore del cu:

1 oz

Maschera di saldatura:

Maschera di soldato nero

Tipo di servizio:

Prototipo di PCB/produzione in serie

Test:

Prova di AOI

Controllo dell'impedenza:

± 10%

Ponte minima con maschera di saldatura:

0,08 mm

Imballaggi particolari:

Pacchetto Vacumm

Evidenziare:

HDI PCB prototype services

high density interconnect circuit board

PCB mass production 0.075mm

Descrizione di prodotto

Product Description:

Product type	8 layer HDI printed circuit board
Material	FR4 High TG 1.6mm
Copper thickness	1/H/H/H/H/H/H/1 oz
Surface finish	EING
Technology	Blind holes and resin plugging
Soldermask	Black
Line width/space	0.1mm

Why Blind Via hole in HDI PCB

Microvias and stacked microvias can be desinged in High Density Interconnect circuit boards, also known as HDI PCBs, to enable complex interconnections in advanced designs.

Microvias, stacked microvias and via-in-pad design allow miniaturization for higher functionality in less space and can accommodate large pin-count chips such as the ones used in cell phones and tablets. Microvias will help reduce layer count in printed circuit board designs while enabling higher routing density and eliminating the need for through vias.

Consumers' growing demand for more functionality in compact and portable electronic devices—including PDAs, mobile phones, and AI products—is pushing the industry toward smaller feature sizes, finer process geometries, and more compact printed circuit boards. For engineers addressing these evolving requirements, the adoption of high-density interconnect (HDI) technology has become essential.

HDI PCB technology enables the production of circuit boards with through-hole, blind, or buried vias without relying on conventional mechanical drilling methods. To successfully implement HDI, users must not only evaluate and apply this next-generation technology, but also understand its limitations in areas such as layer stack-up design, via and microvia formation, achievable feature sizes, and the key distinctions between HDI and conventional printed circuit board technologies.

Etichette:

Bordo flessibile del PWB

PWB rigido

PWB di rame

PCB flessibile rigido

Bordo di alluminio del PWB

PWB di hdi

PWB pesante del rame

PCB Rogers

Bordo del PWB del LED

Assemblaggio PCB di potenza

Bobina del PWB

PWB rapido di giro

PWB ad alta frequenza

Assemblea del PWB di SME

Bordo flessibile del PWB

PWB rigido

PWB di rame

PCB flessibile rigido

Bordo di alluminio del PWB

PWB di hdi

PWB pesante del rame

PCB Rogers

Bordo del PWB del LED

Assemblaggio PCB di potenza

Bobina del PWB

PWB rapido di giro

PWB ad alta frequenza

Assemblea del PWB di SME

products details

HDI PCB PCB Prototype Mass Production Minimum Line Space 0.075mm High Density Interconnect Circuit Board Services

HDI PCB PCB Prototype Mass Production Minimum Line Space 0.075mm High Density Interconnect Circuit Board Services

HDI PCB prototype services

high density interconnect circuit board

PCB mass production 0.075mm

Product Description:

Why Blind Via hole in HDI PCB