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High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type

Brand Name:	Customized
MOQ:	1 pannello
prezzo:	Negoziabile
Payment Terms:	T/T

Detail Information

Descrizione di prodotto

Detail Information

Place of Origin:

China

Certificazione:

ISO9001, ISO13485,IS014001

Tipo di scheda:

6 strati

Materiale di base:

FR4/ROGERS/Tg alta

Maschera di saldatura:

Maschera di saldatura verde

Ponte minima con maschera di saldatura:

0,1 mm

Finitura superficiale:

EING

Tipo di servizio:

Prototipo di PCB/produzione in serie

Misurare:

Personalizzato

Spessore del cu:

1 oz

Dimensione massima del substrato:

24×32

Imballaggi particolari:

Pacchetto sottovuoto

Evidenziare:

HDI PCB prototype service

high density interconnect PCB production

printed circuit board mass production

Descrizione di prodotto

Product Description:

The HDI PCB is a high density interconnect printed circuit board designed to meet the demanding requirements of modern electronic applications. With its advanced manufacturing techniques and superior material choices, this product ensures exceptional performance, reliability, and precision in complex circuit designs. The HDI PCB features an impressive minimum line space of 0.075mm, allowing for extremely fine circuit patterns that support miniaturization and high functionality in compact spaces. This capability makes it an ideal solution for cutting-edge electronics where space savings and high circuit density are critical.

HDI PCB Design DFM Requirements

Normally, DFM requirements relating to clearances in HDI PCB are quite strict, but it can be come tured by taking advantage of your design rules in your PCB design software. Some of the important DFM requirements to gather before layout and routing include:

Circuit width and spacing limits
Annular ring and aspect ratio limits, especially for high reliability designs and requirements
Material choice used in the board to ensure impedance control in the required stackup
Impedance profiles for the desired stackup or layer pairs if available
Blind vias connect exterior layer to at least one interior layer without penetrating the entire board.
Buried vias connect one or more inner layers together without any connections to the exterior layers of a board.
Any layer HDI refers to the use of stacked copper-filled microvias to connect multiple layers in a PCB.

High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type 0

Etichette:

Bordo flessibile del PWB

PWB rigido

PWB di rame

PCB flessibile rigido

Bordo di alluminio del PWB

PWB di hdi

PWB pesante del rame

PCB Rogers

Bordo del PWB del LED

Assemblaggio PCB di potenza

Bobina del PWB

PWB rapido di giro

PWB ad alta frequenza

Assemblea del PWB di SME

Bordo flessibile del PWB

PWB rigido

PWB di rame

PCB flessibile rigido

Bordo di alluminio del PWB

PWB di hdi

PWB pesante del rame

PCB Rogers

Bordo del PWB del LED

Assemblaggio PCB di potenza

Bobina del PWB

PWB rapido di giro

PWB ad alta frequenza

Assemblea del PWB di SME

products details

High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type

High Density Interconnect Printed Circuit Board With PCB Prototype and Mass Production Service Type

HDI PCB prototype service

high density interconnect PCB production

printed circuit board mass production

Product Description:

HDI PCB Design DFM Requirements