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GT SMART (Changsha) Technology Co., Limited
Email alice@gtpcb.com Telefono 86-153-8898-3110
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Customized Copper PCB Board 1.6mm for High-Performance Applications
  • Customized Copper PCB Board 1.6mm for High-Performance Applications

Customized Copper PCB Board 1.6mm for High-Performance Applications

Marca Customized
Certificazione ISO9001, TS16949, ISO14001,
Dettagli del prodotto
Spessore:
1,6 mm
Finitura superficiale:
LF HAL
Speciale:
Materiale base in rame
Applicazioni:
Industriale, potere
Tipo di prodotto:
PWB di rame della base
Evidenziare: 

Customized Copper PCB Board 1.6mm

,

High-Performance Copper PCB

,

Copper PCB Board with Warranty

Termini di trasporto & di pagamento
Quantità di ordine minimo
1 pannello
Prezzo
Negoziabile
Imballaggi particolari
Pacchetto sottovuoto
Tempi di consegna
1-2 settimane
Termini di pagamento
T/T
Descrizione di prodotto

Product Technical Parameters:

Product type Copper base PCB Board
Applications Industrial, Power
Surface Finishing LF HAL
Thickness 1.6mm

The difference between copper base PCB and normal PCB:


Feature Copper Base PCB (MCPCB) Normal FR4 PCB
Core Material Solid Copper plate/core. FR4 (Fiberglass woven cloth and epoxy resin).
Primary Advantage Thermal Management (Heat Dissipation). Cost-Effectiveness and Design Flexibility.
Thermal Conductivity (W/m·K) Excellent: Up to 400 W/m·K (Pure Copper). Poor: Typically 0.3 to 0.4 W/m·K (Epoxy Resin).
Current Handling Very High. The thick copper base can also be used as a ground/power plane or heat sink. Limited. Relies on the copper trace thickness (typically 1-2 oz).
Mechanical Strength High Rigidity. The metal core provides excellent durability and resistance to warping/vibration. Moderate. Sufficient for most consumer electronics but less robust.
Coefficient of Thermal Expansion (CTE) Lower and Better Matched to the copper circuit layers. Higher (especially in the Z-axis), leading to thermal stress and potential PTH/via failure during temperature cycling.
Design Flexibility Limited Layer Count (mostly single or double-sided) due to the solid metal core. Excellent. Supports complex, multi-layer designs (4, 6, 8+ layers) for high-density routing.
Cost Higher. Copper is an expensive material, and processing is more specialized. Low. Cost-effective and widely available for mass production.
Typical Applications High-power LEDs, motor controllers, power supplies, automotive electronics, and high-frequency communication modules. Consumer electronics (smartphones, computers), low-to-mid power devices, and complex digital circuits.

Contattici in qualunque momento

86-153-8898-3110
Stanza 401, edificio n. 5, parco tecnologico di Dingfeng, comunità di Shayi, città di Shajing, distretto di Bao'an, Shenzhen, provincia del Guangdong, Cina
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